تجهیزات

Clients were provided with interactive resin supply and chip delivery"Unit level manufacturing"ProgrammeAfter the resin supply,Right after the actual chip.Before the resin changes,That's when you can finish your actual act.Therefore,Every physical spot on the baseboard can achieve a stable and high-quality physical assembly.And..,It can also be checked through a live camera(OP)Pre-conformity status after resin supply,And the post-conformity state of the actual chip.Check the cell level,Quality confirmation at any time during manufacture achieved.

Main specification
Brand	Panasonic
Model	MDP200
Type 1	SMT Equipment
Type 2	Soldering Equipment
Type 3
Size	W 1 950 * D 1 190 * H 1 720
Weight	2 200kg
Voltage	San AC 200, 220, 380, 400, 420, 480 V　2.7 kVA
Rated power
Gas source	0.49±0.05Mpa
Operating System
Other

Parameters
Productivity	0.56 s/Crystal(Highest speed preposition actual)/ 0.75 s/IC
Load Precision	XY : ±25 µm(Direct live),/ ±15μm(Prearranged field) / ±7μm(Rewind the chip)
Base size(mm)	L 50 * W 30 〜 L 280 * W 140 (Ultrasound Real:L 200 * W 150 )
Crystal varieties	Most12Types(AWCSpecifications) / 10Types(Tray Switch Tray Specification) / 5Types(Tile changer crystal circle specification)
Waste supply	The way the pressure is painted,Transfers
Full load	Space Header Specification :0.5N~10N(Options :1N ~ 50 N) / VCMHeader Specification:1N ~ 50N(Options:2N ~ 100N)
Workhead heating	Heat with constant heat　Heated air pressure specification:Maximum Settings 250℃ / Heating ultrasound specifications:Maximum Settings 300℃
Base plate heating	Heat with constant heat　Maximum Settings 300℃
Power	San AC 200 V ±10 V,50/60 Hz,Max4 kVA　(When heating specification:Max7 kVA)
Device Dimensions(mm)	Standard Specifications(Maximum base length 200 ) : W 1 950 * D 1 190 * H 1 720 (Include Feeder/Feeder) (Device Body : W 1 190 * D 1 190 * H 1 720 )
Weight	2 200kg
Air pressure source	0.5 MpaAbove,30 L /min