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Panasonic MDP200 Soldering Equipment

設備ブランド: Panasonic
デバイスタイプ: Soldering Equipment
デバイスモデルコード: MDP200
設備価格:
製品の詳細
Clients were provided with interactive resin supply and chip delivery"Unit level manufacturing"ProgrammeAfter the resin supply,Right after the actual chip.Before the resin changes,That's when you can finish your actual act.Therefore,Every physical spot on the baseboard can achieve a stable and high-quality physical assembly.And..,It can also be checked through a live camera(OP)Pre-conformity status after resin supply,And the post-conformity state of the actual chip.Check the cell level,Quality confirmation at any time during manufacture achieved.
Main specification
BrandPanasonic
ModelMDP200
Type 1SMT Equipment
Type 2Soldering Equipment
Type 3
SizeW 1 950 * D 1 190 * H 1 720
Weight2 200kg
VoltageSan AC 200, 220, 380, 400, 420, 480 V 2.7 kVA
Rated power
Gas source0.49±0.05Mpa
Operating System
Other
Parameters
Productivity 0.56 s/Crystal(Highest speed preposition actual)/ 0.75 s/IC
Load Precision XY : ±25 µm(Direct live),/ ±15μm(Prearranged field) / ±7μm(Rewind the chip)
Base size(mm) L 50 * W 30 〜 L 280 * W 140 (Ultrasound Real:L 200 * W 150 )
Crystal varieties Most12Types(AWCSpecifications) / 10Types(Tray Switch Tray Specification) / 5Types(Tile changer crystal circle specification)
Waste supply The way the pressure is painted,Transfers
Full load Space Header Specification :0.5N~10N(Options :1N ~ 50 N) / VCMHeader Specification:1N ~ 50N(Options:2N ~ 100N)
Workhead heating Heat with constant heat Heated air pressure specification:Maximum Settings 250℃ / Heating ultrasound specifications:Maximum Settings 300℃
Base plate heating Heat with constant heat Maximum Settings 300℃
Power San AC 200 V ±10 V,50/60 Hz,Max4 kVA (When heating specification:Max7 kVA)
Device Dimensions(mm) Standard Specifications(Maximum base length 200 ) : W 1 950 * D 1 190 * H 1 720 (Include Feeder/Feeder) (Device Body : W 1 190 * D 1 190 * H 1 720 )
Weight 2 200kg
Air pressure source 0.5 MpaAbove,30 L /min

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