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TRI TR7007QPLUS (Online) SPI Solder Paste Inspection

Марка обладнання: TRI
Тип опреми: SPI (Solder Paste Inspection) Machine
Код моделі обладнання: TR7007QPLUS
Ціна обладнання:
Подробиці про продукт
TR7007Q Plus 3D SPIThe platform is equipped with optimized motion control systems(EtherCat)And strengthened2DLight source module,It is possible to accurately detect the defects of the low Tin Bridge and to make up for themPCBProcess Error. TR7007Q PlusI can get up to4Group Digital Stripe Projection,To ensure that shadow-free detection takes place. SPISolutions simplify production lines andMESData exchange process between,Retroactivity of production line connection data.
Main specification
BrandTRI
ModelTR7007QPLUS
Type 1SMT Equipment
Type 2SPI (Solder Paste Inspection) Machine
Type 3(Online) SPI Solder Paste Inspection
SizeTR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm
WeightTR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm
Voltage200-240VAC
Rated power
Gas source72psi-87psi
Operating System
Other
Parameter Table
ItemSpecifications
Imaging MethodStop-and-Go Imaging
Camera4 Mpix or 12 Mpix (factory setting)
Imaging Resolution 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
LightingEnhanced 2D Lights (RGB+W)
3D Technology 4-way Digital Fringe Pattern
Field of View 4 Mpix@ 10 µm: 20.3 x 20.3 mm //4 Mpix@ 15 µm: 30.5 x 30.5 mm //12 Mpix Camera Link@ 5.5 µm*: 22.5x16.5 mm //12 Mpix Camera Link@ 10 µm: 40.8x30.7 mm //12 Mpix Camera Link@ 15 µm: 61.2x46.1 mm //12 Mpix CoaXPress@ 6 µm*: 24.4x18.4 mm //12 Mpix CoaXPress@ 10 µm: 40.8x30.7 mm // * 5.5 μm and 6 μm are not available for TR7007Q Plus DL
Imaging Speed Up to 3 FOV/sec
Height Resolution 0.45 μm
Max. Solder Height 420 μm/840 μm
X-Axis Control Ballscrew + EtherCAT motion controller
Y-Axis Control Ballscrew + EtherCAT motion controller
Z-Axis Control Ballscrew + EtherCAT motion controller
X-Y Axis Resolution 0.5 μm
Z-Axis Resolution 1 µm
Max PCB Size TR7007Q Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm TR7007Q Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane
PCB Thickness 0.6 - 5mm
Max PCB Weight 3kg. Optional: 5kg
Top Clearance @5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm
Bottom Clearance 40 mm
Edge Clearance 3mm
Conveyor Height  880 – 920 mm * SMEMA Compatible
DefectsInsufficient Paste /Excessive Paste /Shape Deformity /Missing Paste & Bridging
Measurement Height Area Volume Offset
WxDxHTR7007Q Plus: 1000 x 1400 x 1650 mm TR7007Q Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm
WeightTR7007Q Plus: 750 kg TR7007Q Plus DL: 830 kg

Попередній:FUJI XP141 SMT machine

Наступний:TRI TR7007DPLUS (Online) SPI Solder Paste Inspection

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