TRIgroundbreaking3D AOISolutions,Use hypervelocity hybridsPCBTesting,Combining optical with blue rays3DReal contour measurement,Maximum coverage for automated detection of adverse phenomena.Combining state-of-the-art software solutions and third-generation smart hardware platforms,Provides stable and powerful3D Tin Point and Component Deficiencies Detection,High detection coverage and simple programming advantages.• Speed2D+3DTest,Detectable01005Widget• High deficiency coverage,Mixed2D+3DTesting techniques• Real3Dcontour measurement techniques,Double-pulsion unit• Smart rapid programming interface with automated databases and offline programming
| Main specification | |
|---|
| Brand | TRI |
| Model | TR7700SIII3D |
| Type 1 | SMT Equipment |
| Type 2 | AOI (Automatic Optical Inspection) |
| Type 3 | SMT AOI Machine |
| Size | 1100 x 1670 x 1550 mm |
| Weight | 1100 x 1670 x 1550 mm |
| Voltage | |
| Rated power | |
| Gas source | |
| Operating System | |
| Other | |
| Parameter Table | |
|---|
| Item | Specifications |
| Imaging Method | Dynamic Imaging with true 3D profile measurement |
| Top Camera | 4 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 10 µm, 15 µm (factory setting) |
| Lighting | Multi-phase RGB+W LED |
| 3D Technology | Single/Dual 3D laser sensors |
| Max. 3D Range | 20 mm |
| Imaging Speed | 4 Mpix@ 10 µm 2D: 60 cm²/sec 4 Mpix@ 15 µm 2D: 120 cm²/sec 4 Mpix@ 10 µm 2D+3D: 27-39 cm²/sec* 4 Mpix@ 15 µm 2D+3D: 40-60 cm²/sec* * Depending on board size and laser resolution |
| X-Axis Control | Ballscrew + AC-servo controller |
| Y-Axis Control | Ballscrew + AC-servo controller |
| Z-Axis Control | N/A |
| X-Y Axis Resolution | 1um |
| Max PCB Size | TR7700 SIII 3D: 510 x 460 mm TR7700L SIII 3D: 660 x 460 mm TR7700 SIII 3D DL: 510 x 250 mm x 2 lanes, 510 x 550 mm x 1 lane |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25mm |
| Bottom Clearance | 40mm |
| Edge Clearance | 3 mm [5 mm optional] |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| WxDxH | TR7700 SIII 3D: 1100 x 1670 x 1550 mm TR7700L SIII 3D: 1300 x 1650 x 1650 mm TR7700 SIII 3D DL: 1100 x 1770 x 1550 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | TR7700 SIII 3D: 1030 kg TR7700L SIII 3D: 1250 kg TR7700 SIII 3D DL: 1150 kg |
