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Back to Back configuration enables Dual Lane processing, matching printer strategy to dual lane strategy with maximum flexibilityand Momentum world-class performance.

Main specification
Brand	MPM/Speedline
Model	MOMENTUM®BTB
Type 1	SMT Equipment
Type 2	Solder Paste Printing & Jetting
Type 3	Solder Paste Printer
Size	1195.4x1394x1589.4mm
Weight	Crated Weight 1090.5 kg (2399 lbs);Machine Weight 797 kg (1757 lbs)
Voltage	200 to 240 VAC (±10%) single phase @50/60Hz, 15A
Rated power
Gas source	100 psi at 4cfm (standard run mode) to 18cfm (vacuum wipe) (6.89 bar @ 1.9 L/s to 8.5 L/s), 12.7 mm diameter line, OD x 9.5 mm ID line
Operating System
Other

BOARD HANDLING
Maximum Board Size (X x Y)	609.6mmx508mm (24x20inch)
Minimum Board Size (X x Y)	50.8mmx50.8mm (2x2inch)
Size of base plate thickness	0.2~5.0 mm (0.008~0.20inch)
Maximum base weight	4.5 kg (10 lbs)
Blank Edge	3.0 mm (0.118inch)
Bottom gap	12.7mm(0.5 inch) Standard.Configureable25.4mm (1.0 inch)
Baseboard holding	Fixed top clamps, centernest vacuum
Baseboard Support Method	Magnetic Top(Optional: Vacuum Block,Vacuum pin,Support block,Special kits,Patented Automatic Devices,Quik-Tool)
Notes	A dedicated workholder is required for boards with an X size greater than 20inch

PRINT PARAMETERS
Maximum print area (X x Y)	609.6mmx508mm (24x20inch)
Print Simulation(Snap-off)	0~6.35 mm (0~0.25inch)
Printing speed	0.635mm/s~304.8mm/s(0.025 in/s~12 in/s)
Printing pressure	0~22.7 kg (0 lb~50 lbs)
Template Frame Dimensions	737mmx737mm(29x 29inch)A smaller size template option

VISION
Image View Field (FOV)	10.6mmx8.0mm (0.417x0.315inch)
Baseline point type	Standard Shape Reference Point (SeeSMEMAStandard),Weldette /Open
Camera system	Single digital camera(MPM Patented Up/Down vision system)

PERFORMANCE
System-wide accuracy and repetition precision	±12Micrometres(±0.0005")@6σ, Cpk ≥2.0
Actual welding and repeat precision	±20Micrometres(±0.0008")@6σ, Cpk ≥2.0

Cycle Time
Momentum BTB	9 seconds standard
Momentum BTB HiE	7.5 seconds standard