TR7700QE-SBased on having5.5 µmHigh Resolution and12 MPHigh-precision platform for imaging technology,For semiconductors and seals. One Stop3D AOIIt's capable of detecting wiring,Sticky Jing,SMD,Deficiencies like cams and tin dots,And smart 3D AOIThe solution improves accuracy by measuring functionality and flexible testing algorithms.• Semiconductor and containment technology detection• Super precision stop3D AOI• Callwire and sticky crystal defects detection• Passed without delayTRIIntelligence testing library
| Main specification | |
|---|
| Brand | TRI |
| Model | TR7700QES |
| Type 1 | SMT Equipment |
| Type 2 | AOI (Automatic Optical Inspection) |
| Type 3 | SMT AOI Machine |
| Size | 1100 x 1730 x 1750 mm |
| Weight | 1100 x 1730 x 1750 mm |
| Voltage | 200-240VAC |
| Rated power | |
| Gas source | 72psi-87psi |
| Operating System | |
| Other | |
| Parameter Table | |
|---|
| Item | Specifications |
| Imaging Method | Stop-and-Go Imaging |
| Top Camera | 12 Mpix |
| Angle Camera | N/A |
| Imaging Resolution | 5.5 µm |
| Lighting | Multi-phase true color LED |
| 3D Technology | Quad Digital Fringe Projectors |
| Max. 3D Range | 12 Mpix@ 5.5 µm: 4 mm |
| Imaging Speed | 12 Mpix 3D @ 5.5 µm: 4.1 cm²/sec 12 Mpix 2D @ 5.5 µm: 10.3 cm²/sec Note: Depending on component distribution |
| X-Axis Control | Linear Motor with Motion Controller (Ballscrew + AC Servo Motor Optional) |
| Y-Axis Control | Dual driven ballscrew + AC-servo with Motion Controller |
| Z-Axis Control | Ballscrew + AC Servo with Motion Controller |
| X-Y Axis Resolution | 1 µm |
| Max PCB Size | 330 x330 mm* *Depending on component distribution, the vailable PCB size could be different |
| PCB Thickness | 0.6-5 mm |
| Max PCB Weight | 3 kg |
| Top Clearance | 25 mm |
| Bottom Clearance | 40 mm. Optional: 100 mm |
| Edge Clearance | 3 mm. Optional: 5 mm |
| Conveyor | Inline Height: 880 – 920 mm * SMEMA Compatible |
| Component | Missing Tombstoning Billboarding Polarity Rotation Shift Wrong Marking (OCV) Defective Upside Down Extra Component Foreign Material Lifted Component |
| Solder | Solder Fillet Height Solder Volume % Excess Solder Insufficient Solder Bridging Through-hole Pins Lifted Lead Golden Finger Scratch/Contamination |
| WxDxH | 1100 x 1730 x 1750 mm Note: not including signal tower, signal tower height 520 mm |
| Weight | 920 kg |
