TR7007D Plus 3D SPIThe platform is equipped with optimized motion control systems(EtherCAT)And tall2DLight Model Group,It is possible to accurately detect the defects of the low Tin Bridge and to make up for themPCBProcess Error. TR7007D PlusYes2Group-digit stripe projection,To ensure that shadow-free detection takes place. SPISolutions simplify production lines andMESData exchange process between,Retroactivity of production line connection data.
| Main specification | |
|---|
| Brand | TRI |
| Model | TR7007DPLUS |
| Type 1 | SMT Equipment |
| Type 2 | SPI (Solder Paste Inspection) Machine |
| Type 3 | (Online) SPI Solder Paste Inspection |
| Size | TR7007D Plus: 1000 x 1400 x 1650 mm TR7007D Plus DL: 1000 x 1500 x 1650 mm |
| Weight | TR7007D Plus: 1000 x 1400 x 1650 mm TR7007D Plus DL: 1000 x 1500 x 1650 mm |
| Voltage | |
| Rated power | |
| Gas source | |
| Operating System | |
| Other | |
| Parameter Table | |
|---|
| Item | Specifications |
| Imaging Method | Stop-and-Go Imaging |
| Camera | 4 Mpix or 12 Mpix (factory setting) |
| Imaging Resolution | 5.5 μm, 6 μm, 10 μm , 15 µm (factory setting) |
| Lighting | Enhanced 2D Lights (RGB+W) |
| 3D Technology | 2-way Digital Fringe Pattern |
| Field of View | 4 Mpix@ 10 µm: 20.3 x 20.3 mm 4 Mpix@ 15 µm: 30.5 x 30.5 mm 12 Mpix Camera Link@ 5.5 µm*: 22.5x16.5 mm 12 Mpix Camera Link@ 10 µm: 40.8x30.7 mm 12 Mpix Camera Link@ 15 µm: 61.2x46.1 mm 12 Mpix CoaXPress@ 6 µm*: 24.4x18.4 mm 12 Mpix CoaXPress@ 10 µm: 40.8x30.7 mm * 5.5 μm and 6 μm are not available for TR7007Q Plus DL |
| Imaging Speed | Up to 3 FOV/sec |
| Height Resolution | 0.45 μm |
| Max. Solder Height | 420 μm/840 μm |
| X-Axis Control | Ballscrew + EtherCAT motion controller |
| Y-Axis Control | Ballscrew + EtherCAT motion controller |
| Z-Axis Control | Ballscrew + EtherCAT motion controller |
| X-Y Axis Resolution | 0.5 μm |
| Z-Axis Resolution | 1 µm |
| Max PCB Size | TR7007D Plus: @5.5 & 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm TR7007D Plus DL: @10 & 15 μm - 510 x 310 mm x 2 Lanes, 510 x 590 mm x 1 Lane |
| PCB Thickness | 0.6 - 5mm |
| Max PCB Weight | 3kg. Optional: 5kg |
| Top Clearance | @5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm |
| Bottom Clearance | 40 mm |
| Edge Clearance | 3 mm |
| Conveyor Height | 880 – 920 mm * SMEMA Compatible |
| Defects | Insufficient Paste Excessive Paste Shape Deformity Missing Paste & Bridging |
| Measurement | Height Area Volume Offset |
| WxDxH | TR7007D Plus: 1000 x 1400 x 1650 mm TR7007D Plus DL: 1000 x 1500 x 1650 mm Note: not including signal tower, signal tower height 515 mm |
| Weight | TR7007D Plus: 750 kg TR7007D Plus DL: 830 kg |
