Machine parameters:
1.High-speed high-precision multi-function modular placement machine
2.0.18 seconds / CHIP ultra-high-speed placement (optimal conditions) 16200CPH (grain / hour)
3.IPC9850 state, placement speed up to 16200CPH (equivalent to 0.22 seconds / CHIP)
4. Mounting 0603 components, the whole accuracy of up to ± 50 microns, the whole repeatability of up to ± 30 microns.
5. Wide range of applications, from 0201 (imperial) micro-components to 31mm QFP large components can be applied
6. Use of two high-resolution multi-vision digital camera
7. Continuous identification of all solder balls for CSP/BGA components, including the judgment of the defect of the solder balls.
8. Optional YAMAHA patented flying nozzle head, can effectively reduce the machine idle losses
9. The best choice for universal popularization
10.Y-axis is driven by the left and right ends of the high-power servo cussing and high rigidity screws, this new development of completely fixed dual drive technology to improve the acceleration and drive through the coordination of synchronization between the two ends, perfecting the acceleration function and shorten the positioning time.
Substrate size M type: L460*W335(MAX)-L50*W50(MIN)
L type: L460*W440(MAX)-L50*W50(MIN)
Mounting accuracy Absolute accuracy (μ+3σ): ±0.05mm/chip, ±0.05mm/QFP
Mounting speed 0.18sec/CHIP 1.7sec/QFP,1608/CHIP:16200CPH
Components 0603-31mm components, SOP/SOJ/QFP/connector/PLCC/CSP/BGA
Overall Dimension 1650*1408*1900
Model YV100II
Mounter speed: 0.25 # / CHIP high-speed mounting
substrate size: L600 * W400 (Ma clever just like W50 (Min)
substrate thickness : 0.4-3.0
mounting accuracy: ± 0.1mm / CHIP, ± o.08 / QFP
power supply: three-phase AC220/208/230/240/380/400/416V ± 10%, 50/60HZ power 4KVA
mounting component: 1005 ~ QFP, SQP, S execution, PLCC (25mm) BGA (0.4p)
