Equipment

Tokyo Heavy Industries JUKI Mounter JX-350

Equipment dimensions (W*D*H): 1920 mm X1580 mm X1550 mm

Equipment weight: about 1670kg

Power requirements: three-phase AC200/220/240/380/400/415V

Air source requirement: 0.5±0.05MPa

Equipment introduction:

JUKI long substrate high-speed placement machine JX-350 features: high-precision, high-speed placement, high-speed mobile unified identification. A high-resolution laser sensor is mounted on the placement head to identify the position and angle by reading the shadow created by the laser irradiating the element. Uniform identification is performed in a short distance to the placement position, enabling high-speed, high-precision placement of small components such as chip components and SOPs. High Stability Powerful recognition ability for component deviations Laser recognition mainly captures the shape of the component from the front and side, so as to reduce the influence of unstable factors such as the electrode shape and color of the chip component, and ensure stable and high-precision recognition. Reducing the defect rate and improving placement quality with the component inspection function Using laser recognition, it is possible to monitor the suction of components through the screen before mounting, and it is possible to prevent defective placement of small components that cannot be identified by air pressure. Advanced carry-back check and vertical inspection of post-placement components reduce defective mounting.