Corresponding to hybrid mounting including high-speed mounting of small LEDs and bare chips to flip chip mounting Modular High-Speed Mounter One NXT-H can simultaneously handle wafers, tray feeders, and tape feeders. By simply changing the feeding equipment, the feeding method can be completely switched (primarily tape feeding or primarily tray/wafer feeding). Based on a high-rigidity structural design, equipped with linear motor drive and high-function cameras. Achieves high-precision and high-quality mounting through advanced control technology and optimized pressure control. After installing HEPA filters, the machine's internal cleanliness reaches Class 1000. Designed for cleanroom use with dust-proof XY mechanisms. Configuring HEPA filters creates an optimal working environment for semiconductor components. Features a 15-inch large touchscreen and graphical interface. Integrates operation of the main unit and MWU12i. Supports both wafer map information management and format changes. ※User formats are individually configured.
| Main specification | |
| Equipment type 1 | SMT Equipment |
| Equipment type 2 | Mounting Equipment |
| Equipment type 3 | Mounter |
| Equipment size | 1360 x 2136 x 1478 mm |
| Gas source | 0.5Mpa |
| Mounting Accuracy | |
| H08M(Q) | ±0.015 mm Cpk≧1.00 |
| G04F(Q) | ±0.008 mm Cpk≧1.00 |
| Wafer Feeding Unit | |
| MWU12i-FC | When using adapters, mixed loading of 4-, 6-, 8-inch wafers and tray components in cassettes is possible. |
| Fixed Feeder Station (16 slots) | W4～W16mm tape feeders, Rotary flux dipping unit |
| MWU12i / MWU12i-FC Specifications | |
| Chip Size | 0.5～15 mm |
| Loaded Wafer Types | 25 types |
| Standard Lifter Pot | φ12, φ23, φ30, φ45 |
| Id | Part No. | Name(EN) | Name(CN) | Specification | Count |
| 1 | NC03B | Spout box | 吸嘴盒 | | |
| 2 | 2AGTHA009100 | Head Syringe | 吸嘴杆 | | |
