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UP2000 HiEPlatforms with various options,If you can triple the capacity of the new generation of double-box welders,YThe axle plate bearings and the unique ability to provide a fast, lightning-like product conversionGel-Flex™Baseboard Support System.It's based on industry leadershipMPMThe reliability of the platform,It has several characteristics necessary for electronic processing——Speed,Reliability and precision.

Main specification
Brand	MPM/Speedline
Model	UP2000HiE
Type 1	SMT Equipment
Type 2	Solder Paste Printing & Jetting
Type 3	Solder Paste Printer
Size	1168.4x1606.3x1636.7mm
Weight	677 kg(Threshold 1134 kg)
Voltage	115VAC@60hz,30 A or 220VAC@50hz,20 A
Rated power
Gas source	80 to 125 psi (5.522 to 8.63 bars) @ 4 cfm (1.9 L/s) (Standard),@ 25 cfm (11.8 L/s) (Configure Vacuate Wiper Select)
Operating System
Other

Specifications
Baseboard Processing(LxW)mm	50x50~508x406
thickness rangemm	0.38~12.7
Bottom Component Gapmm	12.7,(25.4Optional)
Baseboard transmission speed	programmable,60"/sec (1524mm/sec)
Orbital altitude from ground	Reconciliationable,34.5"~41" (876~1041mm)
Printing/Support during visual loop	Drop the nail,Options
Fixed PCB Modalities	Bottom vacuum suction,Y-Subdirectorate and Z-Pick up the instructions (Z-Grip finger)
Orbital fixed edge	By the manufacturer to fix or Backend Fixed
Orbital delivery	User Settings

Print parameters
Print area (X x Y)	18"x16"(457mmx406mm)
Baseboard Gap	-1.3~2.5(mm)
Scratch pressure	0.4-27(kg)
Printing speed	0.25"~12"/sec(6.35mm~305mm/sec)

Visual system
Benchmark points	Optional 2 to 5 Standard reference points Or weld
Identification Point Type	All traditional points of identification are acceptable
Photo recognition system	(MPM Patented Up/Down vision system)

Performance
System-wide accuracy and repetition precision	±0.025mm(±0.001")@6σ, Cpk ≥2.0
Printing cycle	< 11 sec (Other Organiser)