AX8100It's a Japanese-made testBGA,CSP,Backup chip,Motor electronics,Meterboard,SoftnessPCB,High resolution of welding defects in electrons such as semiconductorsXLight equipment, etc;It also appliesSMTAProcess,Monitoring of production processes andBGARefurbishment testing, etc.
| Main specification | |
|---|
| Brand | UNICOMP |
| Model | AX8100 |
| Type 1 | SMT Equipment |
| Type 2 | X-Ray Inspection Machine |
| Type 3 | |
| Size | 1080mm*1180mm*1730mm |
| Weight | 800kg |
| Voltage | AC220V 50HZ |
| Rated power | |
| Gas source | 0.5±0.05Mpa |
| Operating System | |
| Other | |
| Parameters | |
|---|
| Resolution | 77/110Lp/cm145pixels |
| Process | 300mm |
| Port size | 420mm*510mm |
| Control Mode | Mouse,Keyboard,The non-extreme velocity rollerFor full axle position,High pressure information and image parameter editing |
| Tube voltage | 100KV |
| Control the current | 0.3mA |
| Minimum Focus Size | 5μm |
| Process | 150mm |
| Test Area | 400mm*450mm |
| Security | ﹤1μSv/h |
| Geometric magnification factor | 350* |
| Environment | Humidity30-70RHTemperature0°C-40°C |
| Operating systems | Windows XPSystem |
| Testing items | BGA:Bridge,Empty,Not enough tin ointment,Too much tin cream,NolBackup chip:Bridge,Empty,Not enough tin ointment,Too much tin cream CSP:Bridge,Empty,Not enough tin ointment,Too much tin cream,NolQFP:Nol,Not enough tin ointment,Weld-foot movePLCC:Nol,Empty,Not enough tin ointment,Weld-foot move |
| Load table rotates | ±60° |
| Max field of view | 100mm/50mm |
