3 o'clockBefore the furnaceAOI,Behind the stoveAOI,SPIIntegrated monitoringShare information with stickerBad message to sticker,The sticker skips the board and pastesClosed loop control with printing pressTransfer Leaks andXYInformation such as axle offset to printer,Printing press automatically executes corresponding actionsMulti-machine interconnection,Industry-oriented4.0Centralized equipment management;Support for web versionSPC;Fingerprint recognition software and hardware modulePowerfulSPCReal timeSPCMonitoring and analysisData traceabilitySPCSystem & & ClientMESSystem Connection.
| Main specification | |
|---|
| Brand | MAKER-RAY |
| Model | AIS63XSeiresSPI |
| Type 1 | SMT Equipment |
| Type 2 | SPI (Solder Paste Inspection) Machine |
| Type 3 | |
| Size | 1150X1630X1320mm |
| Weight | 870KG |
| Voltage | AC 220,300W |
| Rated power | |
| Gas source | 0.4-0.6Mpa |
| Operating System | |
| Other | |
| Parameters | |
|---|
| Equipment doctrine | 3-D measurements of fine-printed welded steroids using phase-modulated contour measurement techniques,While ensuring high-speed measurements,Significant increase in measurement accuracy |
| PCBADimensions | 50x50mm~510*460mm |
| Widget Height | Top:25mm,Bottom:50mm |
| Camera | 4MPHigh-speed industrial camera |
| Light | RGBWFour-colour spectra source+2Directional structure light projection unit |
| FOV | 30*30mm |
| Resolution | 15μm |
| Orbital Widening | Manual/Automatic |
| Storage | 64GB DDR,240G SSD+2TMechanical Hard Disk |
| graphic cards | TokaRTX2060 8GOrganisation |
| Test content | Area,Volume,Shape,Offset ,Siu Tin,Dosik,Thickness,Li's and so on |
| Width Adjustment | Automatic width adjustment |
| Orbital altitude | 900±30mm |
| Transport orbital direction | Left–Right,Right–Left,Left–Left,Right–Right(Program Settings) |
| Communication | StandardSMEMAInterface |
