Vybavení

YAMAHA In-Line SPI Solder Paste Inspection Machine YSi-SP

Equipment size (W*D*H): 904*1080*1478 (without light tower)

Equipment Weight: 550KG

Power Requirements.

Air Requirements: No air required

The Yamaha In-Line SPI Solder Paste Inspection Machine YSi-SP is a high-precision, high-speed solder paste print quality inspection machine for surface mount technology (SMT) production lines.Below are its key parameters, basic specifications and functional features:

Key parameters and basic specifications

1. Applicable PCB size:

• L510×W460 mm～L50×W50 mm (single-channel specification, no dual-channel specification).

2. Horizontal resolution (FOV size):

• 25µm / 12.5µm (approx. 50 x 50 mm)

• 20µm / 10µm (approx. 40 x 40 mm)

• 15µm / 7.5µm (approx. 30 x 30 mm)

• All are standard selection types.

3. High Resolution:

• 1µm。

4. Testing Program:

• Solder paste print quality (volume, height, area and offset).

5. Power requirements:

• Single phase AC200V-230V ±10%.

6. Air supply requirements:

• No pneumatic specifications.

7. External Dimensions:

• L904×W1,080×H1,478 mm。

8. Weight:

• 约550 kg。

Functional Features

1. "One Head Solution":

• A single head can perform a variety of inspections, including high-speed and high-resolution inspections.

2. High-precision detection:

• Unique measurement algorithms combining 2D and 3D enable highly accurate measurement of solder paste volume, height and area.

3. Machine-to-Machine Solutions (M2M):

• Seamless coordination with other devices, such as automatic setting changes, print position feedback, etc.

4. Statistical Process Control (SPC):

• Supports diverse statistical processing and saves all gasket images and measurement data.

5. Changes are set automatically:

• Automatically sends production line PCB data and conveyor belt width settings by scanning IDs such as PCB barcodes.

6. Feedback print offset:

• Sends feedback print offsets and cleaning cycles acquired by SPI to downstream printers.

7. Optional feature extensions:

• Supports optional features such as super high resolution specification, adhesion check and foreign object check.

summarize

The Yamaha YSi-SP is an in-line SPI device that combines high accuracy, high speed, and versatility for in-line inspection of solder paste print quality on complex PCBs, and its unique "one-head solution" and high-precision algorithms allow it to excel in SMT production lines.