Main specification | |
---|---|
Equipment type 1 | SMT equipment |
Equipment type 2 | Mounting equipment |
Equipment type 3 | Pick-and-place machine |
Equipment size | 1280×2332×1444mm |
Equipment weight | 2470kg |
Power source | 3-phase AC 200/220/380/400/420/480V |
Gas source | 0.5MPa |
Substrate dimensions (mm) | ||
---|---|---|
Single rail | Full mounting | L50×W50 ~ L750×W550 |
Single rail | Dual-position mounting | L50×W50 ~ L350×W550 |
Dual rail (twin) | Twin transport (full) | L50×W50 ~ L750×W260 |
Dual rail (twin) | Twin transport (dual-position) | L50×W50 ~ L350×W260 |
Dual rail (single) | Single transport (full) | L50×W50 ~ L750×W510 |
Dual rail (single) | Single transport (dual-position) | L50×W50 ~ L350×W510 |
Max speed | |
---|---|
Lightweight 16-nozzle head | 38,500 CPH (0.094 s/chip) |
12-nozzle head | 32,250 CPH (0.112 s/chip) |
Lightweight 8-nozzle head | 20,800 CPH (0.173 s/chip) |
3-nozzle head V2 | 8,320 CPH (0.433 s/chip) 6,500 CPH (0.554 s/QFP) |
Mounting accuracy (Cpk≥1) | |
---|---|
Lightweight 16-nozzle head | ±30 μm/chip (±25 μm/chip *6) |
12-nozzle head | ±30 μm/chip |
Lightweight 8-nozzle head | ±30 μm/chip ±30 μm/QFP (12-32mm) ±50 μm/QFP (≤12mm) |
3-nozzle head V2 | ±30 μm/QFP |
Component dimensions (mm) | |
---|---|
Lightweight 16-nozzle head | 03015 *7*8 / 0402 *7 chip ~ L6×W6×T3 |
12-nozzle head | 0402 *7 chip ~ L12×W12×T6.5 |
Lightweight 8-nozzle head | 0402 *7 chip ~ L32×W32×T12 |
3-nozzle head V2 | 0603 chip ~ L150×W25 (diag. 152)×T30 |
Component supply | ||
---|---|---|
Rod | Front/rear exchange cart: Max.15 types (Single rod feeder) Single tray: Max.15 types (Single rod feeder) Dual tray: Max.15 types (Single rod feeder) | |
Tray | Single tray: Max.20 types Dual tray: Max.40 types | |
Tape | Tape width: 4/8/12/16/24/32/44/56mm | For 8-nozzle: 4-56mm For 3-nozzle V2: 4-56/72/88/104mm |
Tape | Max. 120 types (4/8mm tape, small reel) | Front/rear exchange cart: Max.120 types Single tray: Max.86 types Dual tray: Max.60 types |
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